SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications

Massive increase in HPC application performance and interconnect speeds with high bandwidth memories and highly integrated system-on-a-chip in a multi-chip package

SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications. Specifically, SiPearl is relying on Open-Silicon Research’s expertise in deep-submicron physical design implementation, advanced 2.5D packaging and global supply chain management to develop the highly integrated, high-performance 6nm system-on-a-chip (SoC) named RHEA.

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SiPearl’s RHEA SoC is designed in a leading-edge 6nm process node and will be implemented by Open-Silicon Research and manufactured at Taiwan Semiconductor Manufacturing Company (TSMC). OpenFive is a long-standing partner of TSMC through its Value Chain Aggregator (VCA) program. Applications using artificial intelligence (AI) such as autonomous driving, facial recognition, and genomics are generating vast amounts of data, and driving demand for new HPC systems with massive increases in compute performance and interconnect speeds. The RHEA 6nm SoC is purpose built for HPC applications and provides a powerful, highly scalable solution with tremendous improvements in memory bandwidth enabled by Open-Silicon Research’s High Bandwidth Memory (HBM2E) IP subsystem, die-to-die (D2D) interconnect, and HBM memory die into a single 2.5D advanced package.

Open-Silicon Research will also contribute leading-edge deep-submicron physical design methodology that will make it possible to efficiently implement the very large and complex 6nm SoC, together with advanced 2.5D packaging expertise to manage the very high thermal dissipation, and supply chain experience to ensure a smooth ramp up to volume production.

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“We highly regard our partnership with Open-Silicon Research, and we’re excited to utilize the company’s experience implementing very large deep-submicron custom silicon designs, together with their global supply chain management track record shipping production volumes, to deliver this highly complex 6nm SoC solution with differentiated HBM2E IP in a highly advanced 2.5D package,” said Philippe Notton, Founder of SiPearl. “We are confident that this partnership will enable vast opportunities to develop new HPC applications with our mutual customers.”

“SiPearl is a global leader in HPC, and we’re extremely proud to be partnering with them in the development of this next-generation SoC solution,” said Huzefa Cutlerywala, Vice President of International Sales and Managing Director of Open-Silicon Research in India. “This initiative leverages the collaborative advanced silicon expertise of both companies and will greatly advance the adoption of custom SoCs in sub-6nm process nodes, with 2.5D packaging and unleash the very high memory throughputs needed for HPC applications.”

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