Integration of Valens Chipsets Into Mercedes-Benz S-Class Marks the First Ever Multi-Gigabit Symmetric Link in the World to Be Deployed in a Production Vehicle
Valens, the semiconductor company that is pushing the boundaries of connectivity, announced that its VA6000 chipsets are integrated in the Mercedes-Benz S-Class, launched in September of last year. This marks the first multi-gigabit symmetric link in the world to be deployed in mass production, and the only multi-gigabit technology over unshielded wiring for in-vehicle connectivity.
The VA6000 chips are the highest bandwidth long-reach solution deployed in vehicles for flexible ethernet-based infotainment and telematics systems architectures, including head units, multimedia boxes, and smart antenna connectivity.
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“Mercedes-Benz AG is one of the world’s most trusted carmakers, known for integrating only top-of-the-line technology in their cars. Our chipsets are best in class,” said Valens CEO Gideon Ben-Zvi. “This cooperation is a testament to our company’s operational skills, quality compliance, excellence in execution and relentless customer support.”
The VA6000 integrated circuit aggregates USB, Ethernet, Audio and Serial Control signals, for a total bidirectional bandwidth of 1.5Gbps, over a single unshielded twisted pair cable with a length of up to 15 meters (50 feet), and up to four inline connectors.
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Valens is already working on the next generation of symmetric connectivity solutions, which will be streamlined chipsets optimized for specific automotive use cases. Both companies, Valens and Mercedes-Benz AG take advantage of the joint collaboration to empower future cars with unique connectivity solutions.
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