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Si2 Workshop Explores Global Effort to Measure AI Compute Capacity and Infrastructure

An international effort to assess artificial intelligence compute capacity and help governments make informed AI infrastructure investments is the focus of an online workshop hosted by Silicon Integration Initiative, January 29, 8:00-10:00 am PST.

Keith Strier, vice president, Worldwide AI Initiatives at NVIDIA, will discuss the AI Compute Task Force created in early 2020 by the Organisation for Economic Co-operation and Development. The OECD is a Paris-based intergovernmental economic group with 37 member countries, founded in 1961 to stimulate economic progress and world trade. The task force is developing a framework to measure and benchmark domestic AI compute capacity and other AI readiness components, including budgets and investment priorities.

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Their work could also address concerns that wealthier countries are making outsized investments in AI compute capacity, possibly leading to a global compute divide that will sustain resource inequalities in a global digital economy. Strier chairs the OECD task force and has primary responsibility for the NVIDIA global public sector portfolio and the AI Nations Partnership Initiative. He also advises national and city government leaders on AI policies and infrastructure.

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The workshop also features Yiorgros Makris from the University of Texas at Dallas. He will discuss how machine learning can reduce semiconductor testing costs, increase test quality, improve yield and test floor logistics, and guide designers and process engineers.

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Makris is a professor of Electrical and Computer Engineering and co-founder of the NSF Industry-University Cooperative Research Center on Hardware and Embedded System Security. His research focuses on applying machine learning and statistical analysis to develop trusted and reliable integrated circuits and systems, emphasizing the analog/RF domain.

The workshop will conclude with an update on the Si2 AI/ML in EDA Special Interest Group. Speakers are Joydip Das, SIG chair and senior engineer, Samsung Austin R&D Center; and Kerim Kalafala, SIG co-chair and senior technical staff member, IBM EDA.

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