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Computing
StarlingX 8.0 Delivers Enhanced Stability, Scalability, Support for RAN, Distributed Cloud…
StarlingX the open source edge computing and IoT cloud platform optimized for low-latency and high-performance applications is available in its 8.0…
GL’s Multi-Protocol Emulation Test Suite for IP Networks
GL Communications Inc., a global leader in telecom test and measurement solutions, addressed the press regarding their solutions for emulating various…
Scale Computing Introduces Industry-Changing Zero-Touch Provisioning Innovation, Decreasing Edge…
Scale Computing, a market leader in edge computing, virtualization and hyperconverged solutions, announced an industry-changing, innovative new…
Clarivate and KAIST Innovation Strategy and Policy Institute Release Report on the Global AI Chip…
Clarivate Plc, a global leader in connecting people and organizations to intelligence they can trust to transform the world, and the KAIST Innovation…
Pickering Interfaces Announces Strategy for Reducing Test Development Time Using Simulation Tools
Pickering Interfaces, a global supplier of modular signal switching and simulation solutions for use in electronic test and verification, announced…
Elektrobit and Canonical Announce EB Corbos Linux Built on Ubuntu
Elektrobit and Canonical announced EB corbos Linux – built on Ubuntu, an industry first bringing the largest open-source Linux community to automotive…
Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market
Qualinx, a pioneer in ultra-low power tracking and connectivity solutions, has announced its Series A investment of €8 million by FORWARD.one,…
Seeed Studio Upgrades to Elite Tier of NVIDIA Partner Network, Driving Pioneering AIoT Solutions to…
Seeed Studio, a leading AIoT hardware company, is proud to announce its upgrade to the Elite level of the NVIDIA Partner Network (NPN), the program's…
Industry First PCI Express 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s
Teledyne LeCroy, the worldwide leader in protocol test solutions, announced availability of their PCI Express (PCIe) 6.0 CEM x16 interposer for…
Winbond Joins UCIe Consortium to Support High-Performance Chiplet Interface Standardisation
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology. This…