Avicena Demonstrates Record-Breaking Ultra-Low-Energy Optical Chip-to-Chip Interconnect

AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC).

Interconnects have become the key bottleneck in modern compute and networking systems. Highly variable workloads are driving the evolution of densely interconnected, heterogeneous, software-defined clusters of XPUs, hardware accelerators, and high-performance shared memory. Exploding Artificial Intelligence (AI)/Machine Learning (ML) and High-Performance Computing (HPC) workloads are accelerating the need for interconnects with ultra-low power consumption, ultra-high bandwidth density, and low latency.

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“We have already demonstrated LightBundle links at less than 2pJ/bit using our LightBundle technology,” says Bardia Pezeshki, founder and CEO of Avicena, “and will soon demonstrate sub-1pJ/bit links.” LightBundle is based on arrays of innovative GaN micro-emitters that leverage the microLED display ecosystem and can be integrated onto high performance CMOS ICs. Avicena is working with Lumileds, one of the world’s top GaN LED innovators, to rapidly ramp production of highly optimized microLED arrays.

“Avicena’s demonstration of record low power consumption with its LightBundle interconnect technology is proof of the advances Lumileds has made in microLEDs,” says Willem Sillevis-Smitt, Head of Marketing at Lumileds. “We are looking forward to enabling vastly lower power in data center interconnects.”

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