Artificial Intelligence | News | Insights | AiThority
[bsfp-cryptocurrency style=”widget-18″ align=”marquee” columns=”6″ coins=”selected” coins-count=”6″ coins-selected=”BTC,ETH,XRP,LTC,EOS,ADA,XLM,NEO,LTC,EOS,XEM,DASH,USDT,BNB,QTUM,XVG,ONT,ZEC,STEEM” currency=”USD” title=”Cryptocurrency Widget” show_title=”0″ icon=”” scheme=”light” bs-show-desktop=”1″ bs-show-tablet=”1″ bs-show-phone=”1″ custom-css-class=”” custom-id=”” css=”.vc_custom_1523079266073{margin-bottom: 0px !important;padding-top: 0px !important;padding-bottom: 0px !important;}”]

UNICOM Engineering Announces Liquid and Immersion Cooling Portfolio for High-Density Computing

Explore the Next Generation of Sustainable Server Technology for the Data Center

UNICOM Engineering, a leading strategic system integration partner providing application platforms, deployment solutions, and lifecycle support services for software technology developers, data center infrastructure, and OEMs worldwide, has launched a new portfolio of immersion-ready servers for both single and two-phase immersion cooling. These servers were designed to expand the boundaries of today’s data centers by addressing the compute, density, and storage requirements of current and future workloads. “Customers are quickly adopting this advanced technology,” said Austin Hipes, Chief Technologist and VP of Engineering at UNICOM Engineering. “As data centers try to reduce their carbon footprint, the drive to develop new cooling technologies is imperative. As a result, liquid and immersion cooling are increasingly seen as essential technologies for the efficient and sustainable operations of high-performance workloads, in any location.” UNICOM Engineering’s latest product portfolio offers immersion-ready servers that are density optimized for compute-at-scale with full w******* and field service, all from a trusted partner.

Top NLP Update: Natural Language Processing: The Technology That’s Biased

UNICOM Engineering builds on the success of our previous platform families while utilizing familiar and trusted technology from leading Tier-1 providers like Intel and Dell Technologies. “Working hand-in-hand with these core partners, UNICOM Engineering offers Direct to Chip Liquid Cooling solutions and fully validated and supported immersion-ready platforms to meet high-density, dynamic business requirements and data center standardization initiatives,” says Hipes. These 1U and 2U systems support a variety of configurations to address specific compute, storage, and accelerator functionality. The systems are also designed to address workloads from High-Performance Computing (HPC), High-Performance Data Analytics (HPDA), and High-Frequency Trading (HFT) to traditional corporate IT, virtual desktop infrastructure, and even AI and Machine learning.

Related Posts
1 of 40,581

AI and ML NewsAI: Continuing the Chase for Brain-Level Efficiency

As a design and integration specialist, UNICOM Engineering offers comprehensive services that can provide everything from direct to chip liquid cooling solutions to immersion conversion and completely custom-designed server solutions optimized for density in an immersion environment. Additionally, as a strategic system integration partner, they offer the regulatory compliance, logistics, installation services, and global support that immersion solutions require.

UNICOM Engineering provides comprehensive validation and optimization services to ensure smooth technology transitions. Field application engineers work with customers to ensure they understand how to take full advantage of Liquid and Immersion Cooling and its feature-rich values.

AI ML in Marketing: AI and Big Data Analysis Used to Find Brands’ Emotional Connection

[To share your insights with us, please write to sghosh@martechseries.com]

Comments are closed.