Advantest to Showcase Latest Semiconductor Test Solutions for 5G, Automotive and IoT Applications at SEMICON Korea 2020

Leading semiconductor test equipment supplier Advantest Corporation will feature its newest test solutions for advanced ICs at SEMICON Korea on February 5-7 at COEX in Seoul, South Korea.

In addition to high-speed memory test solutions, Advantest will exhibit a wide range of products and solutions that contribute to the 5G revolution and accelerate the development of other revolutionary applications such as ADAS/autonomous driving, IoT/smart devices and AI.

“This year’s product showcase will highlight our continuous efforts to contribute to the evolving semiconductor industry by enabling leading-edge test technologies,” said Judy Davies, Advantest’s vice president of global marketing communications. “By reinforcing our core businesses and pioneering new activities, we are continuing to address the emerging needs and challenges of the ever-changing semiconductor supply chain.”

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Product Displays

In Advantest’s booth #610 in Hall C, new product highlights will include the V93000 Wave Scale Millimeter solution, the industry’s first integrated and modular multi-site millimeter-wave (mmWave) ATE test solution to cost-effectively test 5G-NR mmWave devices up to 70 GHz; two new modules integrated with the new round-type HIFIX for the T2000 series test platform, designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles; the MPT3000ARC, the industry’s first test platform to combine thermal-control capability with high throughput, enabling extreme thermal testing of solid-state drives (SSDs) including PCIe Gen 4; and SoC system-level test solutions from Advantest Test Solutions (ATS).

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Other products and solutions to be featured include the V93000 SMU8 System for next-generation DC parametric testing required on the 28-nm to 3-nm process nodes and beyond; T5800-series memory testers providing end-to-end test solutions from wafer-level to final test; the T5503HS2 system, the only tester of its kind to evaluate the advanced features of next-generation, high-speed LPDDR5 and DDR5 memory ICs; HiFIX high-speed memory test solutions supporting advanced device testing at speeds over 16 Gbps; the EVA100 measurement system with HVI (high-voltage VI source and measurement) modules that extend the platform’s range to include high-power ICs used in large-volume consumer applications; the E3650, a high-end MVM-SEM for measuring next-generation photomasks; the F7000 e-beam lithography tool for the 1X-nm technology node; and an array of software tools and services to improve overall productivity and test quality by creating a test cell solution complete with handler and tester.

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