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Efinix Selects Winbond HyperRAM for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced that Efinix, an innovator in programmable product platforms and technology, has selected Winbond’s HyperRAM memory to power a new generation of camera and sensor systems such as AI, IoT, thermal cameras, industrial cameras, robotics, and smart devices. Delivering ultra-low power in a high-performance and small form factor design, the Winbond 256Mb x16 HyperRAM 2.0e KGD provides the Efinix Titanium Ti60 F100 FPGA with a complete memory system that is easy to implement for bringing products to market quickly and cost-effectively.

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“Device manufacturers are adding sensors and connectivity to virtually all next-generation applications, driving the need for increased processing power at the edge while keeping the devices small and compact,” said Winbond. “HyperRAM is optimized for these applications by delivering ultra-low power through a hybrid sleep mode, design simplicity due to less active pins, and a tiny die size. Brand customers or system makers can easily design Ti60 (SiP 256Mbx16 HyperRAM KGD) with smaller PCB size to fit into compact application devices like wearable camera.”

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