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Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

  • Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company launch new Universal Chiplet Interconnect Express (UCIe) technology to establish a chiplet ecosystem and future generations of chiplet technologies.
  • UCIe 1.0 specification ratified to provide a complete standardized die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing to enable end users to easily mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.
  • New open standard establishes an open chiplet ecosystem and ubiquitous interconnect at the package level. Interested companies and institutions are encouraged to join.

-Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

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“Microsoft is joining the UCIe industry organization to accelerate the pace of datacenter innovation and enable new breakthroughs in silicon design. We look forward to combining efforts of the organization with our own achievements to drive step-function improvements in silicon architecture for the benefit of our customers.”

The organization, representing a diverse ecosystem of market segments, will address customer requests for more customizable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

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Universal Chiplet Interconnect Express (UCIe) Specification now available

The founding companies also ratified the UCIe specification, an open industry standard developed to establish a ubiquitous interconnect at the package level. The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols, and software stack which leverage the well-established PCI Express (PCIe) and Compute Express Link (CXL) industry standards. The specification will be available to UCIe members and available to download on the website.

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