Applied Optoelectronics Chooses ClassOne Technology’s Solstice S8 System to Help Meet Rising AI Data Center Demand
Fully automated Solstice single-wafer system to perform plating and metal lift-off on indium phosphide substrates
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it is providing its Solstice® S8 single-wafer processing system to Applied Optoelectronics, to further strengthen AOI’s capabilities for producing advanced optoelectronic components that power high-speed data and communications infrastructure.
Optimized to address increased demand from AOI’s artificial intelligence (AI) data center customers, the fully automated Solstice S8 will be configured for gold (Au) electroplating and single-wafer metal lift-off (MLO) processes on 3-, and 4-inch indium phosphide (InP) substrates. InP serves as a base for growing highly efficient and high-performance optoelectronic devices, as its direct bandgap allows for efficient light emission and absorption—making these substrates critical to the production of laser diodes and optical transceivers.
Also Read: AiThority Interview with Jerry Caviston, CEO at Archive360
As generative AI and high-speed data processing drive exponential growth in optical interconnect requirements, AOI is scaling its production to meet market needs. “The rapid ramp in demand from AI-driven data centers has made it essential for us to scale production efficiently while maintaining the highest possible device performance,” said Stephen Hu, deputy director of wafer and chip production at AOI. “ClassOne’s Solstice S8 offers both the throughput and the process uniformity we need to support this growth with confidence.”
“We look forward to supporting AOI as they expand to meet the demands of the AI infrastructure market,” said ClassOne CEO Byron Exarcos. “The Solstice S8 is engineered for high-volume compound semiconductor processing, and its flexibility and automation make it ideal for critical steps like gold plating and metal lift-off on InP substrates.”
Also Read: Basics Of Modern AI Architecture Impacting Enterprise Operations
[To share your insights with us as part of editorial or sponsored content, please write to psen@itechseries.com]
Comments are closed.