Daily AI Roundup: Biggest Machine Learning, Robotic And Automation Updates

This is our AI Daily Roundup. We are covering the top updates from around the world. The updates will feature state-of-the-art capabilities in artificial intelligence (AI), Machine Learning, Robotic Process Automation, Fintech, and human-system interactions.

We cover the role of AI Daily Roundup and its application in various industries and daily lives.

NVIDIA AI-powered Exceptional Performance Garners Influencers Praise, Reveals GlobalData

NVIDIA Corp has reported better-than-expected quarterly revenue for the first three quarters of 2023 driven by demand for its chips to power artificial intelligence (AI). This has prompted widespread acclaim from industry influencers, hailing it as a triumph in the realm of AI.

HCLTech and Intel Foundry Expand Collaboration to Advance Semiconductor Innovation

HCLTech, a leading global technology company, is expanding their longstanding collaboration with Intel Foundry to co-develop customized silicon solutions for semiconductor manufacturers, system OEMs and cloud services providers to enhance foundry services.

Vodafone Turkey Deploys Adtran Optical Cesium Solution in National Timing Network

Adtran announced that Vodafone Turkey has deployed its Oscilloquartz optical cesium atomic clock technology to bring new levels of resilient timing to its nationwide network. Adtran’s first-to-market solution will deliver robust protection against disruptions to GNSS signals, enabling Turkey’s leading service provider to maintain uninterrupted, reliable connectivity even while it readies 5G services.

Tata Elxsi Announces Strategic Partnership with AccuKnox for 5G Managed Security Services

Tata Elxsi, through its NEURON product suite, announces a strategic partnership with AccuKnox, the developer of NIMBUS, a state-of-the-art cloud-native security solution. This collaboration marks a significant advancement in network transformation and security, offering operators a comprehensive solution for building and securing autonomous networks.

Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology

Ansys and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology, which uses EMIB technology to connect the die flexibly and without the need for through-silicon vias (TSVs).

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