Revealed at OFC 2025 in San Francisco, Mixx Technologies’ Advanced 3DS Platform Provides Silicon Level End-to-End Connectivity to Enable Limitless Performance for the Most Ambitious Workloads
Mixx Technologies, Inc., a pioneer in next-generation optical interconnect solutions, today announced its Advanced 3DS Platform, an ultra-efficient connectivity fabric that is redefining AI and high-performance computing (HPC) infrastructure. The platform includes an intelligent Engine that unifies compute, memory and network to unleash unparallelled AI performance; a Package that integrates Mixx Technologies’ Engine with core ASICs to ignite a new era of intelligence by powering super XPUs with lightning-fast connectivity; and a System comprised of exaflop scale computing with petabit end-to-end connectivity to transform rack scale compute into the future. Mixx Technologies’ Advanced Platform will be on display this week at the OFC 2025 Conference on April 1-3, 2025 at the Moscone Center in San Francisco in two locations – the Corning booth (#1643) and the US Conec booth (#1443).
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Traditional interconnects are struggling to keep pace with the explosive demands of AI workloads. Driven by investments in AI infrastructure, Gartner forecasts that data center systems spending will grow 23.2%, to reach $405 billion in 2025. Dell’Oro Group also forecasts that worldwide data center spending is projected to surpass $1 trillion by 2029. As a result, interconnect bottleneck challenges are poised to increase as investments to support AI infrastructure continue to grow. Mixx is disrupting the AI industry by leveraging silicon-integrated optics to deliver non-blocking and energy efficient data movement. This breakthrough empowers enterprises to keep pace with the unprecedented challenges of AI workloads, ensuring that infrastructure remains future-proof with standards-compliant solutions.
Mixx Technologies’ Advanced 3DS Platform provides intelligent orchestration with flexible resource allocation, real-time inference and large-scale AI training through multi-petabit interfaces. With low latency and high-throughput, the optical interconnects seamlessly integrate with advanced ASICs to reduce network complexity and ensure continuous operation for dynamic AI workloads. These groundbreaking capabilities not only solve critical infrastructure bottlenecks of today, but are purpose-built to scale with tomorrow’s technology to support future AI and HPC innovation.
“We are energizing the future of technology, building the foundation for the AI-driven world of tomorrow,” said Vivek Raghuraman, Co-Founder and CEO of Mixx Technologies, Inc. “We are on a mission to enable cost effective scaling —delivering higher performance per dollar per watt for sustainable compute connectivity. Our goal is not just to build another product, but to fundamentally rethink AI interconnects. Our innovative Advanced 3DS Platform makes this possible by unlocking unprecedented performance and ensuring that AI workloads can scale beyond the limitations of today’s architecture.”
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Mixx Technologies’ Advanced 3DS Platform provides:
- Mixx’d Intelligence: Enabling intelligent orchestration with flexible resource allocation – Compute where you need it, when you need it.
- Unmatched Speed: Accelerating real-time inference and large-scale AI training through multi-petabit interfaces with low latency and high-throughput.
- Engineered For Reliability: Siliconizing optical interconnects that seamlessly integrate with advanced ASICs – a reliability-first approach that reduces network complexity and ensures continuous operation for real-time AI workloads.
- Future-Proof: Building today’s innovations with tomorrow’s technology – keep your infrastructure ahead of the curve with standards-compliant solutions.
With decades of experience in silicon photonics, networking and system architecture, Mixx Technologies brings deep expertise to lead the evolution of AI and HPC infrastructure. Founded by domain experts Vivek Raghuraman and Rebecca K. Schaevitz, Mixx Technologies has been instrumental in developing and scaling next-generation interconnects, bringing multiple products from concept to high-volume deployment at Broadcom, Intel and Corning. With its extensive partner ecosystem, including leading semiconductor companies, hyperscalers and tier-1 suppliers, Mixx Technologies collaborates to qualify and drive the adoption of cutting-edge AI interconnect solutions.
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