NXP Opens Electronica 2018 with Solutions for Machine Learning at the Edge for Industry 4.0 Applications
Company officially launches Industrial Competency Center (ICC) to help customers and partners tackle some of industrial IoT’s toughest hardware and software development challenges
NXP Semiconductors N.V. will showcase solutions that pave the way for the Industry 4.0 revolution including edge-based machine learning (ML) at next week’s Electronica 2018. Featured applications include facial recognition for access control, object recognition for operator safety, local voice control commands, and artificial intelligence (AI) derived anomaly detection for predicting and preventing failures of industrial systems.
Today, NXP also announced it is officially launching its Industrial Competency Center (ICC), a dedicated multidisciplinary team, including a laboratory based in Hamburg, to support global industrial customers in their digital manufacturing strategies.
“To accelerate and deploy machine learning applications, both hardware and software support are key enablers,” said Sylvain Gardet, director of NXP’s ICC “We want to provide the missing link to give manufacturers the flexibility to build their own solutions covering today’s Industry 4.0 hot topics: machine learning, secure industrial communication such as OPC UA and edge-computing, enabling smarter industrial processes and robots.”
The laboratory team led by Christian Wiebus, CTO of ICC, will cooperate closely with customers, standard bodies, system integrators and research partners to develop best-in-class hardware, software and service solutions for Industry 4.0 / Industrial IoT (IIOT).
“NXP’s ICC is already delivering key solutions to its customers and we look forward to further advancing our partnerships,” Wiebus said.
The ICC targets customers who are focused on developing next-generation smart industry applications and addresses the demand to tailor solutions for core IIOT applications such as time sensitive networking (TSN) and Industrial Linux enablement.