OpenFive brings depth of chiplet ecosystem experience from multiple customer engagements
OpenFive, a leading provider of custom silicon solutions with differentiated IP, announced that the company has joined the Universal Chiplet Interconnect Express (UCIe) Consortium as it continues to contribute to open industry standards and ecosystems that accelerate deployment of chiplet connectivity solutions. These solutions deliver power efficient, high-throughput, and low-latency connectivity for High Performance Computing (HPC), datacenter, and cloud applications.
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“By combining our D2D IP with our custom silicon implementation capabilities, and 2.5D advanced package design experience, OpenFive is well positioned to deliver a complete end-to-end chiplet solution.”
OpenFive will actively participate in the Electrical and Protocol subgroups. OpenFive will leverage its depth of experience from multiple customer engagements and its silicon platforms. These include OpenFive Die-to-Die (D2D) Controller and PHY IP on leading-edge silicon process nodes down to 5nm combined with advanced 2.5D packaging.
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OpenFive has played an instrumental role in supporting various chiplet interconnects based on Open High Bandwidth Interface (OHBI) and (Bunch-of-Wire) BoW, through the Open Domain Specific Architecture (ODSA) chapter under the Open Compute Project (OCP). OpenFive introduced the industry’s first Die-to-Die (D2D) Controllers which are agnostic to physical link interfaces and has been awarded multiple customer design wins.
“The addition of UCIe support to our existing OHBI and BoW D2D products is a natural progression for OpenFive, and will allow our customers to choose from a complete D2D product portfolio optimized for HPC and Networking chiplets,” said Ketan Mehta, Senior Director of Interface Products Marketing at OpenFive. “By combining our D2D IP with our custom silicon implementation capabilities, and 2.5D advanced package design experience, OpenFive is well positioned to deliver a complete end-to-end chiplet solution.”
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