Tachyum Joins UCIe Community to Drive In-Package Integration
Tachyum announced it has signed a letter of agreement to become a member of the Universal Chiplet Interconnect Express (UCIe) community to further develop and support the chiplet ecosystem and drive on-package innovations.
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“I have dedicated much of my career to helping overcome the limitations of Moore’s Law by developing technologies that allow for smaller and more power-efficient designs”
UCIe is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. Members of UCIe represent a wide range of industry expertise and include leaders in semiconductors, packaging, IP suppliers, foundries, and cloud services.
The UCIe 1.0 Specification is an open industry standard developed to establish a ubiquitous interconnect at the package level and covers the die-to-die I/O physical layer, Die-to-Die protocols, and software stack which leverage the well-established PCI Express® (PCIe®) and Compute Express Link™ (CXL™) industry standards. The specification is available by request.
Tachyum plans to use the mature chip-to-chip technology for its Prodigy 2 processor at the 3nm level. Multi-die connectivity will play an essential role in both significantly increasing performance of Prodigy 2, as well as increasing the range of performance points and applications Prodigy 2 would be used for.
“I have dedicated much of my career to helping overcome the limitations of Moore’s Law by developing technologies that allow for smaller and more power-efficient designs,” said Dr. Radoslav Danilak, founder and CEO of Tachyum. “By joining UCIe and having Prodigy be part of its emerging chiplet ecosystem, we are creating a system that allows the mixing and matching of the best, proven components from multiple vendors to speed up adoption. We are excited to be among the UCIe members driving integration within the package.”
Prodigy has the potential to create unrivaled computational speed and vast energy saving capabilities for hyperscale, OEM, telecommunication, private cloud and government markets. Prodigy’s 10x lower processor core power consumption will dramatically cut carbon emissions associated with data center usage. Prodigy’s 3x lower cost (at equivalent performance) will also translate to billions of dollars in annual savings to hyperscalers like Google, Facebook, Amazon and Alibaba.
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Tachyum’s Prodigy processor can run HPC applications, convolutional AI, explainable AI, general AI, bio AI, and spiking neural networks, plus normal data center workloads, on a single homogeneous processor platform, using existing standard programming models. Without Prodigy, hyperscale data centers must use a combination of disparate CPU, GPU and TPU hardware, for these different workloads, creating inefficiency, expense, and the complexity of separate supply and maintenance infrastructures. Using specific hardware dedicated to each type of workload (e.g. data center, AI, HPC), results in underutilization of hardware resources, and more challenging programming, support, and maintenance. Prodigy’s ability to seamlessly switch among these various workloads dramatically changes the competitive landscape and the economics of data centers.
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