Sonim Partners With FIH Mobile for Next Generation Rugged Feature Phones
Sonim Technologies, Inc. announced the selection of FIH Mobile (“FIH”), a subsidiary of Foxconn Technology Group, to support the engineering and manufacturing of Sonim’s next generation feature phones. These future devices are expected to leverage QUALCOMM chipsets and feature the unique characteristics that have built Sonim’s reputation for the most rugged mobile phones available.
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“We selected FIH for this important partnership due to its globally recognized comprehensive cell phone design, development and production capabilities, which will enable us to accelerate the deployment of our highest volume devices in a cost-efficient way,” said Tom Wilkinson, Chief Executive Officer. “Additionally, by selecting FIH, Sonim’s next generation of feature phone devices will be made at facilities in Vietnam and leverage FIH’s unique experience in rugged device manufacturing and working with all US Carriers.”
Sonim expects to benefit from FIH’s integrated ODM services, including hardware, software, certification and manufacturing. Additionally, working with FIH will provide Sonim access to a best-in-class supply chain and manufacturing process. The first devices are expected to come to market in the third quarter of 2021.