Technology Verizon Takes Major Step Towards Network Slicing Capabilities GlobeNewswire Jun 26, 2023 Successful field demonstration shows initial capabilities of end-to-end, dynamic network resource provisioning on a 5G network. Verizon recently…
Machine Learning KDDI Deploys DriveNets Network Cloud: The First TIP DDBR-Compliant Deployment and First… PR Newswire Jun 12, 2023 DriveNets a leader in cloud-native networking solutions announced that Japanese telecommunications provider KDDI Corporation has successfully …
Technology KDDI Deploys DriveNets Network Cloud The First TIP DDBR-Compliant Deployment and First… PR Newswire Jun 8, 2023 DriveNets a leader in cloud-native networking solutions announced that Japanese telecommunications provider KDDI Corporation has successfully…
5G Technology Sequans and Geotab Extend Relationship with Adoption of Calliope 2 Cat 1bis Technology PR Newswire May 31, 2023 Sequans Communications S.A., a leader in 5G/4G cellular IoT chips and modules announced that Geotab Inc. (Geotab), a global leader in connected…
Machine Learning Supermicro COMPUTEX Keynote Unveils Company’s Accelerate Everything Strategy for Product… PRNewswire May 29, 2023 Super Micro Computer, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, continues to offer IT solutions for decreasing the…
Machine Learning Stmicroelectronics Introduces Its Second Generation Of Industry 4.0-ready Edge AI Powered… Business Wire May 15, 2023 ST’s new STM32MP2 series 64-bit microprocessors come with SESIP Level 3 certification, industrial-application-ready interfaces and dedicated Edge AI…
Machine Learning Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0 PR Newswire May 12, 2023 Samsung Electronics Co. Ltd, a world leader in advanced semiconductor technology, announced its development of the industry’s first 128-gigabyte (GB)…
Technology Cadence Leverages IBM Cloud HPC to Accelerate Electronic Chip and System Design Software Development AIT News Desk May 4, 2023 IBM announced Cadence Design Systems, is leveraging high-performance computing (HPC) with IBM Cloud HPC to help develop its chip and system design…
Machine Learning Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies Business Wire Apr 27, 2023 Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform Cadence Design Systems, announced that the Cadence 112G-LR SerDes is…
Technology Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox… Business Wire Apr 27, 2023 Cadence Design Systems, announced new design flows based on the Cadence Integrity 3D-IC platform to support the TSMC 3Dblox standard for 3D front-end…