Intel demonstrates a tightly controlled eight-wavelength laser array on a silicon wafer with matched power and uniform spacing. What’s New: Intel…

Embedded solutions and partnerships bring Micron’s 176-layer NAND and 1α DRAM innovations to industrial and automotive markets Micron Technology,…

New Ryzen Embedded R-Series system-on-chips provide up to 2X more cores, enhanced Radeon graphics, Windows 11 support, and versatile, multi-display…

Inspur Information, a leading provider of AI solutions, will attend the Computer Vision and Pattern Recognition (CVPR) conference showcasing its…

Fulfilling Corporate Social Responsibilities and Injecting Digital Intelligence into Sustainable Development ZTE Corporation, a major international…

Telit, a global enabler of the Internet of Things (IoT), announced the release of the SE873K5, the latest addition to its SE873 family of modules and…

Purdue’s College of Engineering announced the formation of the Institute of Hard AI on Tuesday (June 14) during the 11th annual meeting of the…

Mass production of world's best-performing DRAM, HBM3, comes just seven months after development announcement HBM3 to be combined with…

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. introduced VIPack, an advanced packaging platform…

AIStation allows for the efficient management of AI and computing resources, and is fully compatible with K8s Inspur Information, a leading IT…