Cadence

8th generation of the industry-leading Tensilica Xtensa LX platform offers significant system-level performance enhancements while delivering…

Highlights: Delivers up to 5X faster RTL convergence and up to 25% improved QoR RTL designers can rapidly get accurate insight into…

Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform…

Cadence Design Systems, announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers…

Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform Cadence Design Systems, announced that the Cadence 112G-LR SerDes is…

Cadence Design Systems, announced new design flows based on the Cadence Integrity 3D-IC platform to support the TSMC 3Dblox standard for 3D front-end…

Cadence Design Systems, unveiled its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process for hyperscale ASICs, artificial…

Complete high-performance 2.5D package solution enables heterogeneous integration Cadence Design Systems, announced the tapeout of Cadence 16G…

Highlights: Industry’s leading platform for creating differentiated custom silicon delivers unmatched productivity benefits with new generative…

Cadence Design Systems, announced that it has demonstrated interoperability between the silicon-proven Cadence LPDDR5X memory interface IP and SK…