Machine Learning Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies Business Wire Apr 27, 2023 Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform Cadence Design Systems, announced that the Cadence 112G-LR SerDes is…
Technology Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox… Business Wire Apr 27, 2023 Cadence Design Systems, announced new design flows based on the Cadence Integrity 3D-IC platform to support the TSMC 3Dblox standard for 3D front-end…