Machine Learning Samsung Electronics Unveils Industry’s Highest-Capacity 12nm-Class 32Gb DDR5 DRAM, Ideal for the AI… Business Wire Sep 1, 2023 Provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and…
Technology Micron Ships World’s Most Advanced DRAM Technology With 1-Beta Node AIT News Desk Nov 2, 2022 Cutting-edge process technology underpins LPDDR5X, now sampling to mobile ecosystem Micron Technology, announced that it is shipping qualification…
Computing Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X… AIT News Desk Jan 27, 2021 Winbond's 4Gb LPDDR4X chip in 200B BGA package offers maximum 4267Mbps data rate at a clock rate up to 2133MHz Winbond Electronics Corporation, a…