Machine Learning Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies Business Wire Apr 27, 2023 Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform Cadence Design Systems, announced that the Cadence 112G-LR SerDes is…
Machine Learning SK hynix to Supply Industry’s First HBM3 DRAM to NVIDIA AIT News Desk Jun 10, 2022 Mass production of world's best-performing DRAM, HBM3, comes just seven months after development announcement HBM3 to be combined with…