hyperscale computing

Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform…

Cadence Design Systems, announced new design flows based on the Cadence Integrity 3D-IC platform to support the TSMC 3Dblox standard for 3D front-end…

Cadence Design Systems, announced that Cadence IP for GDDR6 is silicon proven on TSMC’s N5 process technology, exceeding Cadence’s previous 16Gbps…

Company plans to bring approximately 150 engineering positions to the region over next three years Cadence Design Systems, Inc. announced the opening…

New offering enables up to 10X efficiency gains in system-level testbench assembly, execution and analysis for hyperscale, automotive, mobile and…