Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly…
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Semiconductor
Faraday Announces Plans to Develop Arm-Based 64-Core SoC on Intel 18A Technology
Faraday Technology Corporation, a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the…
IDTechEx: The Age of Artificial Intelligence – AI Chips to 2034
Artificial Intelligence is transforming the world as we know it; from the success of DeepMind over Go world champion Lee Sedol in 2016 to the robust…
Intel and UMC Announce New Foundry Collaboration
Companies to collaborate on the development of a 12-nanometer process platform targeting high-growth markets
Intel Corp. and United…
Qualcomm Appoints Akash Palkhiwala as Chief Financial Officer and Chief Operating Officer
Qualcomm Incorporated announced the appointment of Akash Palkhiwala to the expanded role of Chief Financial Officer and Chief Operating Officer. In…
IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights
Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This…
Mitsubishi Electric CES 2024: Driving a Global, Vibrant, and Sustainable Smart Society
Booth Exhibits Demonstrate Long-Term Vision to Gather Data-Driven Business Insights to Improve Company’s Cross-Industry Offerings and Help Customers…
Ceva and boAt, India’s Leading Audio and Wearable Brand, Announce Strategic Partnership
Companies collaborate to develop compelling and innovative wireless audio solutions for earbuds, neckbands, headphones, speakers and wearables…
Advantest Launches Real-Time Data Infrastructure Platform Driving the Next Generation of…
Leading semiconductor test equipment supplier Advantest Corporation announced that its newly launched ACS Real-Time Data Infrastructure (RTDI™) has…
Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Cloud…
Synopsys, announced the launch of its new Synopsys Cloud OpenLink program to foster semiconductor industry interoperability through an open cloud…
