Artificial Intelligence | News | Insights | AiThority
[bsfp-cryptocurrency style=”widget-18″ align=”marquee” columns=”6″ coins=”selected” coins-count=”6″ coins-selected=”BTC,ETH,XRP,LTC,EOS,ADA,XLM,NEO,LTC,EOS,XEM,DASH,USDT,BNB,QTUM,XVG,ONT,ZEC,STEEM” currency=”USD” title=”Cryptocurrency Widget” show_title=”0″ icon=”” scheme=”light” bs-show-desktop=”1″ bs-show-tablet=”1″ bs-show-phone=”1″ custom-css-class=”” custom-id=”” css=”.vc_custom_1523079266073{margin-bottom: 0px !important;padding-top: 0px !important;padding-bottom: 0px !important;}”]

Nano Dimension And Hensoldt AG Announce A Joint Venture For Advancing, Prototyping, And Sharing 3D-Electronic Printing Designs

The Vision of the Newly Formed Entity, J.A.M.E.S GmbH, is to Lead a Revolution in Electronic Fabrication and Manufacturing

Nano Dimension Ltd.  an industry leading Additively Manufactured Electronics provider, announced that it has formed a partnership with HENSOLDT AG a global high-tech pioneer for defense and security electronics and a market leader in civilian and military sensor solutions. The recently formed joint venture entity is named J.A.M.E.S GmbH (Jetted Additively Manufactures Electronics Sources, or J.A.M.E.S).

Recommended AI News: EY Named A Leader For Microsoft Implementation Services By IDC MarketScape

Nano Dimension is a leading manufacturer of intelligent machines which 3D-print Additively Manufactured Electronics. HENSOLDT has been using Nano Dimension’s DragonFly PRO and LDM® 3D-AME printer technology since 2018, to fabricate many innovative “first-of” designs, as 3D-printed circuit boards (PCB)/AME 3D Hi-PEDs® (High-Performance-Electronic-Devices). AME is a highly agile and customized method for development, prototyping and fabrication of electronic circuits, which results in a significant reduction of time and cost in the time-to-market process.  In addition, AME delivers a verified design before production begins, resulting in a higher quality product.

HENSOLDT and Nano Dimension have been working together to expand the capabilities of AME 3D Hi-PEDs®. By formalizing their cooperation and co-investing approximately $6M in the new joint venture entity, J.A.M.E.S, HENSOLDT is strengthening its commitment to developing the most advanced technology in 3D printing. The joint venture is led by HENSOLDT Ventures, an independent unit within HENSOLDT, which implements and brings to market new technologies and business models for the HENSOLDT Group.

J.A.M.E.S, based in Taufkirchen, Germany, will combine the strengths of both companies and further advance the development of 3D-printed electronic components. The main objective of J.A.M.E.S is the development of an electronic designer’s community that will exchange designs and methodologies for manufacturing, component integration, and materials for Printed Electronics (PE) and Additively Manufactured Electronics (AME). By connecting the complete value chain of all designers and users-of-designs across corporate and geographical borders, J.A.M.E.S will allow members of its community to develop, prototype, market, and trade AME and PE designs, proof of concepts, and products.

Related Posts
1 of 40,455

Beyond its “cloud presence”, J.A.M.E.S will house an operating fabrication laboratory that will be used for experimentation and support for designs and technologies coming the J.A.M.E.S community. This will make J.A.M.E.S capable of not only being a community for ideation, but a platform to provide prototyping services and AME applications for industry users and its community of members.

Recommended AI News: Parks Associates Announces Consumer Technology Expert Mark Vena As Smart Home And Strategy Leader

Marian Rachow, Head of HENSOLDT Ventures, who will serve on the J.A.M.E.S Board of Directors, commented, “HENSOLDT, as a market leader in the field of sensor technology and optronics, expects the closer cooperation with Nano Dimension to accelerate development cycles as well as spare parts production to respond to customer needs more quickly and cost-effectively. Using special dielectric and conductive nanoparticle inks, it is now possible to design electrical components directly via the printer and bring them into a three-dimensional form.”

Rachow added, “HENSOLDT has been investing in basic research of digital 3D printing of electronic components for several years to make the benefits of this technology available for its own development and production. For example, in collaboration with Nano Dimension, HENSOLDT has already printed the world’s first 10-layer PCB, which carries soldered high-performance electronic structures on both outer sides, using a newly developed polymer ink from Nano Dimension. Increasing competition and accelerated customer procurement timelines will be one of the biggest challenges for established providers in the future. Our joint venture, J.A.M.E.S, not only offers rapid development of technology as a real alternative to conventional electronics manufacturing, but also offers small and medium-sized companies the opportunity to efficiently design new products.”

Yoav Stern, Chairman of the Board & CEO of Nano Dimension, who will serve as the Chairman of the J.A.M.E.S Board of Directors, stated, “I am confident that the co-investment of a supplier of transformative technologies such as Nano Dimension, and an early innovative, advanced adopter, committed to added value disruption such as HENSOLDT, will produce game changing electronic solutions for both suppliers and users of AME/PE. We are on the verge of a revolution in 3D electronic additive manufacturing and are excited to establish a strong ecosystem to drive the development of AME with HENSOLDT. J.A.M.E.S GmbH establishes a strong foundation for a world-wide network to foster research, innovation and ultimately the development of Hi-PEDs® in areas and industries still unexplored.”

Stern concluded, “The newly formed J.A.M.E.S is focused on building a cloud-based platform. In the future, other companies and customers are expected to upload a wide variety of electronic components in their usual CAD/CAM/CAE software and convert them into a new type of AME file on the platform. Furthermore, they will be able to obtain additional designs via the described platform, modify them, add their own form factor and have them printed on-demand.”

Recommended AI News: HUB Security Ltd. And Scaleout Announce Partnership For Secure Federated AI

Comments are closed.