MaxLinear and ColorChip Announce Collaboration on a Complete Line of Optical and Active Electrical Interconnect Solutions

• Industry leading power consumption for 800G cloud applications

MaxLinear, a leading provider of high-speed interconnect ICs that enable next generation fiber-optic modules for data center, metro, and wireless transport networks, and ColorChip, a leading supplier of optical transceivers, DACs, and active electrical cables, announced the availability of a complete line of optical and electrical interconnect solutions for data center applications based on MaxLinear’s 5nm Keystone family of DSPs.

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“Their broad range of manufacturing capabilities and technologies for both optical modules and electrical cable assembly make them an ideal partner for MaxLinear and our end customers, delivering a complete set of solutions for all interconnect needs.”

By leveraging the high-performance, high-density, and industry leading power consumption of the Keystone 5nm IP, ColorChip believes it can offer customers a full line of 400G, 800G, and 1.6T solutions with best-in-class power consumption.

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“MaxLinear’s innovative Keystone 5nm DSP has enabled us to build the industry’s lowest power 13W 800G-DR8 optical modules, which will be on display at OFC 2023, and their KGD bare die solutions have enabled us to implement the highest density 1.6T OSFP-XD AECs on the market,” said Xin Wu, EVP at ColorChip. “We are now leveraging these capabilities to enable a broad range of optical and electrical interconnect solutions for our customers with best-in-class power consumption and performance.”

“ColorChip has been a strong partner for MaxLinear, quickly building best-in-class solutions for our mutual customers,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Their broad range of manufacturing capabilities and technologies for both optical modules and electrical cable assembly make them an ideal partner for MaxLinear and our end customers, delivering a complete set of solutions for all interconnect needs.”

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