Cadence Collaborates with Northrop Grumman on Chip Design

Cadence Partners with Northrop Grumman to Facilitate Continued Advanced-Node Design Innovation

Cadence Design Systems, Inc. announced that it is working with Northrop Grumman on advanced-node system-on-chip (SoC) projects, enabling the delivery of high-quality, high-performance SoCs. Cadence system and verification, digital and signoff, custom/analog and packaging tools, as well as IP solutions, have supported a shortened product development cycle and advanced-node tapeouts.

“Our 30 years of industry experience combined with our comprehensive suite of system design enablement tools, design IP and complementary service offerings, including the Palladium Z1 enterprise emulation platform, has enabled us to address advanced-node tapeouts and continued innovation.”

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“Through our ongoing collaboration with Northrop Grumman, we’re continuing to develop and impart our expertise and capabilities in the aerospace and defense industry, enabling high quality, cost effective, and first pass IC design success of the complex advanced node SoCs required by the industry,” said Paul Cunningham, corporate vice president and general manager of the System & Verification Group at Cadence. “Our 30 years of industry experience combined with our comprehensive suite of system design enablement tools, design IP and complementary service offerings, including the Palladium Z1 enterprise emulation platform, has enabled us to address advanced-node tapeouts and continued innovation.”

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Cadence has extensive experience in the aerospace and defense industry and has provided products and services to Northrop Grumman for more than 20 years.

“Northrop Grumman has a strong history developing system-on-chip designs,” said Vern Boyle, vice president, advanced technologies, Northrop Grumman. “As a result of this, we’ve furthered our leadership position with the creation of mission-critical ASICs, which is a key technology that can help support our nation’s military.”

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