MACOM And MaxLinear Collaborate On 100G, 400G And 800G Solutions For Data Center Applications

• Collaboration demonstrates interoperability between MaxLinear’s DSPs and MACOM’s TIAs

MACOM Technology Solutions Inc. a leading supplier of semiconductor products, and MaxLinear, Inc. a leading provider of radio frequency (RF), analog, digital and mixed-signal integrated circuits, announced a collaboration to assure interoperability of MaxLinear’s PAM4 DSPs and MACOM’s 100G/lane transimpedance amplifiers (TIAs) for 100G/lambda applications. Customers can now select a proven design solution with an exceptionally low bit error rate (BER) for their optical module designs.

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The collaboration includes pairing the MxL93516, MaxLinear’s second-generation 100G Snowmass DSP, with MACOM’s low power MATA-05817 100G TIA to achieve exceptional sensitivity and a low BER floor. This configuration is ideal for 100G-DR1/FR1/LR1 QSFP28 applications for Data Center and front haul applications.

“Our customers are requesting proven high-performance solutions,” said Marek Tlalka, Senior Director, High-Performance Analog, at MACOM. “This collaboration offers the industry a compelling performance proof point and a potential path to shorter design cycle times for 100G, 400G and 800G module manufacturers.”

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“The market for 100G/lambda transceivers continues to grow and performance and time to market are critical for our customers,” said Drew Guckenberger, Vice President of MaxLinear’s High-Speed Interconnect Group. “The pairing of our second generation power optimized Snowmass 100G DSP with integrated driver with MACOM’s high-performance TIAs is an ideal solution for customers, providing tight integration, proven high-performance and low-power capabilities.”

The companies plan to continue collaborating on 400Gbps and 800Gbps applications utilizing the recently announced MaxLinear 5nm Keystone DSPs and MACOM’s extensive portfolio of four channel 400Gbps TIAs.

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