Technology Winbond Joins UCIe Consortium to Support High-Performance Chiplet Interface Standardisation PR Newswire Feb 18, 2023 Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology. This…
Machine Learning Tachyum Joins UCIe Community to Drive In-Package Integration AIT News Desk Apr 26, 2022 Tachyum announced it has signed a letter of agreement to become a member of the Universal Chiplet Interconnect Express (UCIe) community to further…