Computing Synopsys and TSMC Accelerate 2.5D/3DIC Designs With Chip-on-Wafer-on-Substrate and Integrated… AIT News Desk Aug 26, 2020 Synopsys 3DIC Compiler platform reduces design turnaround time for chip-package co-design implementation Synopsys, Inc. announced that Synopsys and…
Machine Learning Ansys Achieves Certification of Its Multiphysics Solutions for TSMC’s 3nm Process Technology AIT News Desk Aug 26, 2020 TSMC grows partnership with Ansys to provide advanced power integrity and electromigration signoff tools for next-generation applications Ansys …
Computing Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology AIT News Desk Aug 21, 2020 Moortec, the go-to leaders of innovative in-chip monitoring solutions announced the availability of its well-established sensing fabric on TSMC's…
News Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud AIT News Desk Jun 15, 2020 Synopsys Major Reduction in Turnaround Time for Next-Generation Chips Achieved Through Collaboration Synopsys, Inc. announced its collaboration…
Autonomous Vehicles NXP Selects TSMC 5-Nanometer Process for Next Generation High Performance Automotive Platform AIT News Desk Jun 12, 2020 NXP’s breakthrough SoC platform, devoted to automotive, aims to simplify and accelerate rapid innovation in vehicle architectures with a focus on…
Automation Synopsys Design Platform Certified for TSMC’s Innovative SoIC Chip Stacking Technology AIT News Desk Apr 25, 2019 Close Collaboration Delivers Design Solutions for True 3D Device Integration Synopsys, Inc. announced that the Synopsys Design Platform has been…